APEX™ Slot Die - Auto Adhesive Applicator

ITW Dynatec’s APEX High Speed Slot Die Applicator is an air-operated hot melt adhesive applicator assembly with an optional filter manifold. The applicator is used with intermittent pressure and constant pressure hot melt adhesive supply units (ASUs). APEX models are offered in six different module configurations.

Overview

Each APEX High Speed Slot Die applicator features various combinations of adhesive valve slot die modules mounted to a single service block. Each module is opened and closed by air pressure. Springs are used to keep the stem seated when no air pressure is supplied to the head. The rate of adhesive flow from the applicator is determined by the adhesive pressure applied by the ASU’s pump, shim thickness and the amount of shim opening.

The applicator is heated by replaceable cartridge heating elements which are controlled by an integrated RTD sensor and electronic control. A single heat zone for the service block and die allows for only one temperature control point on models less than 390mm. Models longer than 390mm have two heat zones and control points. The APEX module(s) is mounted onto either a steel or aluminium service block. A piston inside the module is pneumatically triggered by a solenoid, which allows adhesive to flow through a valve within the module.

The APEX offers a variety of heated adhesive supply hose connections into the service or filter manifolds. Adhesive flows from the hose into and through the channels within the manifold to the module. Air pressure opens the adhesive valve, allowing adhesive to flow through the module’s die assembly when the valve is open. In order to minimize response time, operating air and electrical connects from the solenoid valves are made to each individual module

These slot die applicators can be configured for either ITW Dynatec’s DynaControl controller, Microprocessor Temperature Control/ Compu- Vision (MCV), DynaPlus/ Pro or it can be configured for a competitive upgrade.

• Precise high speed intermittent adhesive patterns
• Self-cleaning die lips permit the use of a variety of adhesive viscosities
• Exceptional value for a high speed slot die applicator
• Slot die design does not require micro adjustments to achieve the required adhesive lay down weights
• APEX™  SD module provides a clean adhesive cutoff regardless of the adhesive pattern

Features

• Ideal for precise high speed intermittent adhesive patterns.
• Optional non-heated die width extension(s) for easier substrate handling.
• Air-operated modules feature spring-assist close for precise cut-off.
• Die lip design prevents build-up of unwanted materials.

The Dynatec Difference

Two factors that any hot melt operation wants to keep in check are product and adhesive waste. The APEX™ HS Slot Die Adhesive Applicator offers a solution with it’s crisp, clean adhesive cutoff that the competition just can’t match. Our design features reverse-acting modules and optimized channels tailored to specific patterns to achieve the performance you only get from ITW Dynatec. Real world tested with a wide range of adhesives and substrates, the APEX™ has been shown to minimize both adhesive and product waste, saving customers like you money every day.

Dimensions